Apple is planning to use liquid metal as a key component of the hinges it will use on its upcoming foldable iPhone, according to Apple industry analyst Ming-Chi Kuo.
Dongguan EonTec is poised to benefit significantly from the widespread adoption of liquid metal in the hinges of the upcoming foldable iPhone. According to recent industry research, Apple is focused on improving durability, enhancing screen flatness, and minimizing crease marks… https://t.co/KsGu49JXkP
— 郭明錤 (Ming-Chi Kuo) (@mingchikuo) March 21, 2025
Using liquid metal, which is manufactured using a die-casting process, as a key component in the hinges should allow Apple to address issues users commonly experience with foldable devices. It is expected to provide better screen flatness, and minimize the crease marks commonly seen in foldable displays.
While Apple has used liquid metal for minor components, such as SIM ejector pins, using it for the hinges on a foldable iPhone would mark the first time the company has used the material for a critical mechanical part.
According to Kuo, Dongguan EonTec will be the exclusive supplier of liquid metal.
The ASP of liquid metal per foldable iPhone is estimated at RMB 70–100. Based solely on the first-generation foldable iPhone, EonTec could see revenue of RMB 1.5–2 billion—a potential 100–200% increase driven by this single order. As more competitors in the foldable phone market turn to liquid metal, EonTec’s growth could accelerate even further.
Rumors about the foldable iPhone’s size range between 7.9 and 8.3 inches in size. The device is expected to use a book-style design similar to Samsung’s Galaxy Z Fold, although some say it may sport a “clamshell” design like Samsung’s Galaxy Z Flip device.
Kuo has previously said the foldable iPhone may include two rear cameras, a single front-facing camera, and Touch ID integrated into the power button. The device could measure just 4.5mm thick when unfolded, and between 9mm and 9.5mm when closed.
Mass production of the first foldable iPhone is expected to begin in the fourth quarter of 2026, suggesting a possible late 2026 or early 2027 release.
(Image credit: Ming-Chi Kuo)
