Apple’s 2026 iPhone lineup (Likely to be called “iPhone 18”) will be powered by a chip using TSMC’s next-generation 2-nanometer fabrication process in combination with a new packaging method that will integrate 12GB of RAM, claims a Weibo post.
In a Weibo post (via MacRumors) on Tuesday, Chinese-language user “Phone Chip Expert” claimed that Apple’s “A20” chip that will power iPhone 18 models, will make a switch from the previous InFo (Integrated Fan-Out) packaging to WMCM (Wafer-Level Multi-Chip Module) packaging. Memory for the device lineup will be upgraded to 12GB.
2026 Apple iPhone’s 2nm processor A20 will adopt a new packaging method, APTS will change from the original InFo to WMCM packaging. The memory will also be upgraded to 12GB, and the entire network will announce it 2 years in advance.
InFo and WMCM have differences in packaging method. InFo integrates several components, such as memory, within the package but focuses on single-die packaging, with memory typically attached to the main SoC. InFo is optimized for reducing the size and improving the performance of individual chips.
Meanwhile, WMCM integrates multiple chips within the same package, allowing for more complex systems, such as CPUs, GPUs, DRAM, and other custom chips to be tightly integrated in one package. WMCM also allows for increased flexibility in arranging chips, while also optimizing communication between them.
All current iPhone 16 models feature 8GB of RAM, which is widely considered to be the minimum required amount for Apple Intelligence. Recently, Apple analyst Ming-Chi Kuo said he expects next year’s 12GB RAM upgrade will be limited to the iPhone 17 Pro Max.
If Kuo is correct, the iPhone 17, iPhone 17 “Slim,” and iPhone 17 Pro will only be equipped with 8GB of RAM, the same amount of RAM that is expected for the entire iPhone 16 lineup this year. The fourth-generation iPhone SE, which is expected to debut in early 2025, is also expected to boast 8GB of RAM.
Kuo also predicts that only the “Pro” and “Pro Max” models in the iPhone 18 series are likely to use TSMC’s next-generation 2nm processor technology due to cost concerns.