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Analyst Ming-Chi Kuo: iPhone 17 to be Powered by 3nm Chip Technology While Only iPhone 18 Pro Models to Use 2nm Chips

Analyst Ming-Chi Kuo: iPhone 17 to be Powered by 3nm Chip Technology While Only iPhone 18 Pro Models to Use 2nm Chips

2025’s iPhone 17 lineup will be powered by processors fabricated using TSMC’s enhanced N3P 3-nanometer chip technology, while only the 2026 iPhone 18 Pro models are likely to be powered by the chipmaker’s next-generation 2nm processor technology. The move is due to cost concerns, according to Apple analyst Ming-Chi Kuo.

The processors for 2025 iPhone 17 models will be made by TSMC’s N3P process/3-nanometer technology. The processor for 2026 iPhone 18 models is anticipated to use TSMC’s 2-nanometer technology. However, due to cost concerns, not all new iPhone 18 models may be equipped with a 2-nanometer processor.

The 3nm and 2nm chip manufacturing technology use smaller transistors to allow more of them to be packed onto a chip, which usually results in improved processing speed, while using less power.

In the last year, Apple has begun using 3nm chips in its iPhone and Mac lineups. Bothe the A17 Pro used in the iPhone 15 Pro lineup and the M3 chips used in Mcs are built using the 3-nanometer fabrication process. Previous chips used the 5nm process. This year’s iPhone 16 lineup is powered by an A18 chip built on a second-generation 3nm process, resulting in improved performance and efficiency over the iPhone 15’s A16 Bionic chip.

TSMC expects to begin mass production of 2nm chips by late 2025, and Apple is expected to use the lion’s share of the intial wave of chips built using the new process. TSMC is building two new facilities to accommodate 2nm chip production, and working on approval for a third.

In 2023, Apple purchased all of TSMC’s initial 3-nanometer chip production for its iPhones, iPads, and Macs. This partnership allows Apple to be a step ahead of its competitors when it comes to integrating cutting-edge semiconductor technology into products.

TSMC will introduce several new ‌3nm‌ improvements in between the 3nm and 2nm nodes.